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Lithography control software: GDSII to wafer

Written in-house and running the job from layout to wafer. No third-party CAM chain, no licence dependencies. MVP level: everything below runs on the tool today.

Live wafer map: a 20 × 20 die array, every field coloured as it is exposed.
Contrast autofocus on a height-map point.
Steps of 0.01 / 0.1 / 1 mm over a calibration slide.

What it does

  • Native GDSII import, layers, automatic tiling
  • Die arrays / step-and-repeat
  • OPC assist and focus-exposure matrix
  • Two-phase contrast autofocus under red light
  • Resist-safe illumination: only blue exposes
  • Per-tile exposure time and dose-sweep wafers
  • Substrate height map, per-field Z
  • CANopen servo motion, exposure interlocks
  • Scientific camera pipeline, scale bar per objective
  • Project files with stale-tile detection
Last height-map point → start exposure → watch it on camera.
The Expose tab.
The Expose tab.
Partnership

Looking for a manufacturing partner and investor

On the table: a working Prototype 1.0, the Prototype 2.0 design, full documentation and in-house software. A partner brings production, supply chain and market access; deal structure and investment size are open. Demonstrations and sample exposures by arrangement.