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Home · Prototype 1.0

Desktop maskless lithography

The machine that proved the idea: a DMD projection lithograph that exposes resist on real wafers straight from a GDSII file. Enclosed desktop unit, 440 nm LED, closed-loop XY stage on servo drives and optical scales, a camera looking through the same objective.

Built and working

How it works

A programmable photomask on a moving stage

Exposure in progress.
The enclosure: head, stage and electronics in one light-tight box with an E-stop.
Render of the enclosure: head, stage and electronics in one light-tight box with an E-stop.
XY stage during assembly.
XY stage during assembly.
After anodizing, assembled.
After anodizing, assembled.

How it works

A TI DLP4710 DMD — 1920 × 1080 micromirrors — is a programmable photomask. Each frame of the layout is projected through a microscope objective onto the resist; the stage steps and stitches frames into one continuous pattern.

Optical scheme
Projection path; the camera shares it.
Autofocus: the objective travels in Z.
Exposure seen from the side.
Stage and enclosure frame, taken apart.
Stage and enclosure frame, taken apart.
Servo drives and optical scales on both axes.
Servo drives and optical scales on both axes.
Rotary platform under the chuck — the first step towards layer-to-layer alignment.
Mask aligner on one side, my maskless prototype on the other.
Mask aligner on one side, my maskless prototype on the other.
Results

Made on this machine

Photographs, not simulations: exposed and developed on Prototype 1.0.

A die array across a whole wafer, stitched by step-and-repeat.
A die array across a whole wafer, stitched by step-and-repeat.
Developed die array.
Developed die array.
On the chuck, inside the tool.
On the chuck, inside the tool.
Grey-scale test: Aivazovsky’s “The Ninth Wave” in resist, under the microscope.
Grey-scale test: Aivazovsky’s “The Ninth Wave” in resist, under the microscope.
Four developed arrays of 8 µm wells in resist, each labelled with its step and exposure time; 100 µm scale bar
Micro-well arrays in resist: 8 µm wells, each array exposed with its own settings (here pitch 75–78, about 3.4–3.5 s per field) and labelled next to it. Spin coating at 2500–4000 rpm, exposure-time sweeps, development.

Precision from calibration

Sub-micron precision here does not come from granite and air bearings. The machine measures its own geometry and illumination with a camera in the wafer plane and cancels them on every field; the software refuses to expose with an uncalibrated objective.

How the calibration works →

Photograph of the exposed test chip, corrected for perspective onto the layout The GDSII layout of the test chip
GDSII layoutIn resist
5 mm
Layout → resist

Design against result

Drag the divider. On the left is the GDSII file that went to the machine; on the right, a photograph of what came out, corrected for perspective so the two line up.

The silicon chip is 25 × 25 mm; the layout on it, a logo with captions and four dithered pictures, takes 20 × 20 mm. One exposure job.

The machine exposes one DMD frame at a time: this chip is 1 869 fields of 0.25 × 0.38 mm, placed side by side by the stage. Switch the picture to Exposure fields and back, and look for the seams.

What ends up in resist depends on development as much as on exposure: developer, time and temperature all change the result. These are samples from process tuning. Works by Magritte and Escher are blurred on both sides: they are still under copyright.

Datasheet

Target specifications

Prototype 2.0. The optical core and software are carried over from Prototype 1.0.

Feature size
0.7–1 µm typicalmin 0.4 µm, optics & resist dependent
Exposure area
100 × 100 mmscalable to 200 × 200 mm
Light source
LED, 440 nm405 nm option · no laser
XY repeatability
0.2 µmclosed loop on optical scales
Position feedback
100 nm scalesdown to 2.5 nm option
Throughput
~2.8 mm²/min @ 1 µm10×; ~0.9 mm²/min @ 0.5 µm (20×)
Light modulator
TI DLP4710 DMD1920 × 1080 micromirrors
Objectives
10× / 0.5 · 20× / 0.75interchangeable
Substrates
Si up to 4″ · glass · PCB
Travel X / Y / Z
≥100 / ≥100 / 40 mm
Design input
GDSII nativeDXF — tuning
Mounting
25 mm grid, M6×1optical-breadboard standard

In development

  • Layer-to-layer alignmentrotary vacuum chuck + alignment workflow in software
  • Automatic objective changemotorized swap between 10× and 20×
  • 405 nm LED optionfor sub-0.5 µm work and broader resist compatibility
  • 2.5 nm optical scalesfor repeatability in the 25–50 nm class

Today it is a single-layer tool: expose, develop, done. If your process needs aligned multilayer now, ask me about the timeline.

Applications

Where it fits

Electronics & PCB

Fine-line boards and flex circuits, straight from the layout — same-day iteration.

Microfluidics

Channel networks, master molds for PDMS, on-chip electrodes.

MEMS & sensors

Resist patterns for etching, lift-off and plating on Si up to 4″.

Photonics

Gratings, diffractive elements, waveguide test structures.

Battery R&D

On-chip test cells, microelectrode platforms, microbatteries.

Education & labs

No laser class, compact, enclosed — real workflows from GDSII to wafer.

Progress

How it got here

A year of iterations. The pre-alpha ran on a different projector with a first program written in Windows Forms; Prototype 1.0 got its own stage, its own software and a stitched exposure process.

The first control program: a table of stage positions with an exposure time for each field
July 2025 · pre-alpha

The first control program

Windows Forms: a table of fields, each with its own position and exposure time — dose sweeps set up by hand.

Microscope, ×2
July 2025 · pre-alpha

First developed well arrays

Test arrays in resist, each exposed in a single projected field with no stitching, labelled with its own exposure settings.

The XY stage with the rotary platform on the bed of a milling machine
Stage rework

Into the milling shop

The XY stage on a milling machine: the rotary platform fitted and the mounting plane machined level.

2026

Prototype 1.0

Its own stage on servo drives and optical scales, the QtLithoCAN software, autofocus and a height map, jobs stitched across whole wafers — everything above on this page.

A test chip made of 1 869 exposure fields shows no visible seams.

Partnership

Looking for a manufacturing partner and investor

On the table: a working Prototype 1.0, the Prototype 2.0 design, full documentation and in-house software. A partner brings production, supply chain and market access; deal structure and investment size are open. Demonstrations and sample exposures by arrangement.